Design007 Magazine

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• Design007 Magazine — September 2025
• Contents — The Signal Integrity Issue
• The Shaughnessy Report — Winning the Signal Integrity Battle
• Feature Interview — Staying on Top of Signal Integrity Challenges
• Short — North American PCB Industry Shipments Up 20.7% in July
• Beyond Design — Slaying Signal Integrity Villains
• Elementary, Mr. Watson — Running the Signal Gauntlet
• Short — HDI PCB Market Projected to Hit $34.23 Billion by 2032
• Feature Article — Understanding Signal Integrity, the Foundation of High-speed Digital Design
• Short — IBM, AMD Join Forces to Build the Future of Computing
• Feature Interview — Signal Integrity: A Game of Margins
• MilAero007 Highlights
• Article — Taking Control of PCB Verification One Step at a Time
• Article — Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
• Target Condition — Rethinking the PCB Stackup Recipe
• Short — EMC-Taiwan Announces Further Investment in North America
• Connect the Dots — Evolution of PCB Manufacturing: Lamination
• UHDI Fundamentals — UHDI Technology and Quality 5.0
• DESIGN007 Top 10
• Career Opportunities
• Educational Resources
• Masthead and Advertising Index