Issue link: https://iconnect007.uberflip.com/i/1539283
4 DESIGN007 MAGAZINE I SEPTEMBER 2025 S E PT E M B E R 2 0 25 The Signal Integrity Issue S h o r t s North American PCB Industry Shipments Up 20.7% in July HDI PCB Market Projected to Hit $34.23 Billion by 2032 IBM, AMD Join Forces to Build the Future of Computing EMC-Taiwan Announces Further Investment in North America I n E ve r y I s s u e MilAero007 Highlights Design007 Top 10 Career Opportunities Educational Resources Advertiser Index 12 23 29 53 34 60 63 70 71 As the old axiom goes, if you don't have signal integrity problems now, you will eventually. Thanks to high-speed data rates and shrinking features and silicon, PCB designers face a whole raft of SI challenges. This month, our expert contributors share various SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more. Feature Columns Winning the Signal Integrity Battle by Andy Shaughnessy Slaying Signal Integrity Villains by Barry Olney Running the Signal Gauntlet by John Watson Rethinking the PCB Stackup Recipe by Kelly Dack Feature Interviews Staying on Top of Signal Integrity Challenges with Kris Moyer Signal Integrity: A Game of Margins with Al Neves Feature Articles Understanding Signal Integrity, the Foundation of High-speed Digital Design by Stephen V. Chavez Articles and Columns Taking Control of PCB Verification One Step at a Time by Kirk Fabbri Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High- Power-density Electronics by Padmanabha Shakthivelu and Nico Bruijnis Evolution of PCB Manufacturing: Lamination by Matt Stevenson UHDI Technology and Quality 5.0 by Anaya Vardya 6 14 20 50 8 30 24 36 42 54 58