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SEPTEMBER 2025 I DESIGN007 MAGAZINE 49 expand the performance of TIMs. However, to fully reap the benefits of these advancements, design- ers must look beyond bulk thermal conductivity and adopt a system-level perspective, one that accounts for the contact mechanics at the interface. In today's power-dense electronics, there is no one-size-fits-all solution for thermal management. Whether designing automotive control units, rugged aerospace systems, or compact power modules, selecting the right TIM is critical to achieving optimal performance, reliability, and manufacturability. MacDermid Alpha understands that every appli- cation presents unique thermal challenges. That is why we have developed a comprehensive port- folio of TIM1 and TIM2 solutions to meet diverse needs across industries such as automotive, power electronics, high-performance computing, telecom, and industrial automation. TIM2 solutions include: • Thermal gap fillers: Including 2K silicone-based formulations engineered for automated, high- volume manufacturing, with outstanding ther- mal performance, mechanical compliance, reworkability, and long-term reliability • Thermal pastes and gels: Offering excellent wetting, low bondline thickness, and ease of rework • Thermal pads: Ideal for legacy systems where reusability and mechanical cushioning are required TIM1 solutions include: • Indium-based materials: Delivering ultra-high thermal performance and reliability for chip- level thermal management • Silver and copper sintering materials: Low- pressure, high-yield die-attach solutions ideal for silicon carbide (SiC) power semiconduc- tors operating in extreme temperatures Our experts work closely with OEMs, Tier 1 sup- pliers, and fabless companies to develop custom- ized strategies that align with specific performance and manufacturing goals. Organizations seeking support with material evaluation, design optimiza- tion, or complex thermal challenges can benefit from addressing thermal interface requirements early in the design process, as rising power den- sity and thermal constraints increasingly shape design decisions. DESIGN007 Padmanabha Shakthivelu is director of product management at MacDermid Alpha Electronics Solu- tions. Nico Bruijnis is director of thermal interface materials at MacDermid Alpha Electronics Solutions.