SEPTEMBER 2025 I DESIGN007 MAGAZINE 61
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Zuken Opens New E3.series
Development Center
Zuken is relocating the E3.series development
team to a new, state-of-the-art facility in Neu-
Ulm. Effective September 1, 2025, the new
headquarters will be located at Meininger
Allee 5, 89231 Neu-Ulm.
New Episode Drop: MKS' ESI's Role in
Optimize the Interconnect
SM
In this latest episode, Casey Kruger, director of product marketing
at MKS' ESI, joins On the Line With… host Nolan Johnson to share
how CO₂ laser technology delivers faster, more accurate vias in
a smaller, more energy-efficient footprint.
Mastering PCB Floor
Planning
Placement of PCB components is far more
than just fitting components onto a board.
It's a strategic and critical foundational step,
often called "floor planning," that profoundly
impacts the board's performance, reliability,
manufacturability, and cost.
Coming Soon: The Advanced
Electronics Packaging Digest
The upcoming Advanced Electronics Packaging
Digest is a curated, condensed monthly publication
designed to keep you informed and engaged with the
fast-moving world of advanced electronics packaging
(AEP). In our inaugural September issue, we will begin
at the foundation with an in-depth interview featuring
Matt Kelly, CTO of the Global Electronics Association.
Global
Excellence in
PCB Design:
The Global
Electronics
Association
Expands to
Italy
In today's rapidly evolving electronics industry,
PCBs serve as the critical backbone influencing the
success, reliability, and time-to-market of countless
products. Recognizing this essential role, the Global
Electronics Association (formerly IPC), a worldwide
leader in electronics standards, certification, and
education, is now expanding its internationally
acclaimed PCB design training to Italy.
