Issue link: https://iconnect007.uberflip.com/i/1539509
22 PCB007 MAGAZINE I SEPTEMBER 2025 F E AT U R E A RT I C L E by C h r i s H u n ra t h , I n s u l e ct ro E MC and Arlon's product lineup includes a suite of new materials supporting advanced PCBs for extreme high-speed applications, and with tougher testing requirements. These products are fully com- mercialized and ready for mass production. EM-371(Z) is an answer to FR-4 builds that are stacking microvias, vias over buried epoxy-filled vias, or have increased requirements for coupon testing. Additionally, EMC has become a Trusted Supplier for IPC-4101 and passed the qualification testing for EM-371(Z) for the specification sheet 126 QPL (Qualified Products Listing). EM-371(Z) is an economical way to achieve a bump in Df performance over phenolic epoxies (Df of 0.015 vs 0.021) while reducing Z-axis CTE and im- proving reliability. If you need increased reflow cycles or a higher number of thermal cycles on test coupons, this is a cost- effective way to get there. Arlon 86HP is a (HDI) high density interconnect/high-speed answer for polyimide, meeting IPC-4101/40,41 slashsheets. Available in ultra-thin fabrics like 1017, it's perfect for HDI build-ups with sequential lamination, substrates, and more. Its low Dk combined with extremely New Laminate Materials to Meet Today's Challenges F i g u re 1 : C ro s s - s e ct i o n of a st a c ke d m i c rov i a P C B u s i n g M E-37 1 ( Z ) m ate r i a l . F i g u re 2 : C ro s s - s e ct i o n of a n a d va n c e d P C B u s i n g A r l o n 8 6 H P m ate r i a l . ▼ ▼