Issue link: https://iconnect007.uberflip.com/i/1539509
10 PCB007 MAGAZINE I SEPTEMBER 2025 F E AT U R E A RT I C L E by Pes h Pa te l , Ve n te c I n te r n a t i o n a l G ro u p A s electronics evolve toward higher perform- ance, smaller form factors, and greater re- liability, PCB materials play a critical role. Traditional prepregs and glass-reinforced dielectrics—long the workhorses of multilayer PCB manufacturing—are reaching their limits when faced with today's demands for high-speed signal integrity, low-loss performance, and advanced thermal management. Ventec's pro-bond and thermal-bond bondply dielectrics are engineered to meet these challenges head-on, delivering solutions for high-performance, high-reliability multilayer PCB stackups across dem- anding markets, including AI computing, data net- working, high-speed communications, automotive electronics, and aerospace systems. What They Are Pro-bond and thermal-bond are non-reinforced bondply materials, available as resin-coated copper (RCC) and resin-coated film (RCF), formulated for exceptional electrical and thermal performance. Unlike traditional glass-reinforced prepregs, these materials eliminate micro Dk variability from glass weave, ensuring signal integrity at high frequencies and in designs with extremely fine features. • RCC Bondply: Unreinforced adhesive coated onto ultra-thin copper foil (1.5–5.0 μm supported by an 18 μm carrier), ideal for ultra-high-density multilayer PCB stackups • RCF Bondply: Unreinforced adhesive coated onto PET film, offering design flexibility in high- performance multilayers where fine-line capabil- ity and precision dielectric control are critical Pro-bond: High-speed, Low-loss Electrical Performance Designed for high-speed digital (HSD) and high- frequency (HF) applications, pro-bond materials are available in dielectric constants (Dk) from 2.8 to 3.05 and dissipation factors (Df) from 0.0007 Driving Next-generation PCB Performance