Issue link: https://iconnect007.uberflip.com/i/1539509
SEPTEMBER 2025 I PCB007 MAGAZINE 9 Khesin tackles the issue of panel warpage and bow and twist, and Shane Whiteside, representing PCBAA, continues a discussion on the "disconnect between stated Pentagon goals and budgetary reality" with no money allocated for the U.S. Defense Production Act for PCBs in 2026. This issue also includes an inter- view with Venkat Raja of Advint, a training company that specializes solely in advancing expertise in electroplating—a topic that goes well with advanced materials. We lost yet another important and beloved member of our indus- try, Walt Custer, just weeks ago. As Dan Feinberg said, "Walt's life was characterized by his unwavering commitment to the industry, his profound wisdom, and willingness to share it, and his infectious enthu- siasm for everything he did." He will be missed. I will end with Steve Williams' column, which tells the story of his father, Chuck Williams, another industry innovator, entrepreneur, and founder of Electro-tek. This issue is packed with news and information you can use right away. If it sparks an idea, please let me know. Let's keep this impor- tant conversation going. PCB007 Marcy LaRont is the managing editor of PCB007 Magazine and executive director of IPC Publishing Group. Marcy started her career in PCBs in 1993 and brings a wide array of business experience and perspective to I-Connect007. To contact Marcy, click here. M A RCY 'S M U S I N G S I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD) a new monthly digital news- letter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level. For decades, breakthroughs in packaging, materials, and design have often been buried deep in white papers, technical reports, or behind the closed doors of standards committees. Advanced Electronics Packaging Digest was created to bring those ideas into wider circulation, ensuring that innovations in materials science, additive manufacturing, and printed metallization reach the engi- neers, decision-makers, and OEMs who can put them into practice. "Our goal with Advanced Electronics Packaging Digest is to highlight the interconnect, one of the most important and continu- ously evolving areas of technology in electronics manufacturing, and showcase the companies driving innovation in materials, additive manufacturing, and printed metallization," said Marcy LaRont, Executive Director of I-Connect007. The inaugural issue features: • Expert commentary from industry leaders addressing packaging challenges and opportunities. • The Global Electronics Association's latest white paper on advanced packaging. • An interview with Matt Kelly, CTO of the Global Electronics Association, on the urgency of system-level integration in advanced packaging. Kelly emphasized the importance of making this knowledge more widely available: "If we don't force the system-level integra- tion of these technologies, then the industry will find out in a few years that some of this stuff doesn't work as well as it should." By transforming specialized research into accessible, industry- wide insight, AEPD aims to accelerate innovation and strengthen collaboration across the electronics manufacturing ecosystem. AEPD is designed for PCB and system designers, engineering decision-makers, OEMs, and business leaders looking for action- able intelligence to guide their technology roadmaps. Subscribe today to Advanced Electronics Packaging Digest and stay ahead of the curve in advanced packaging innovation. For information on advertising, see media kit. I-Connect007 Launches Advanced Electronics Packaging Digest