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4 PCB007 MAGAZINE I SEPTEMBER 2025 S h o r t s I-Connect007 Launches Advanced Electronics Packaging Digest The Printed Circuit Designer's Guide to... DFM Essentials, Chapter 4 Wrinkles in Atomically Thin Materials Unlock Ultraefficient Electronics First Electronic-Photonic Quantum Chip Manufactured in Commercial Foundry North American PCB Industry Shipments Up 20.7% in July I n E ve r y I s s u e MilAero007 Highlights PCB007 Top 10 Career Opportunities Educational Resources Advertiser Index 9 24 33 58 68 38 84 87 94 95 S E PT E M B E R 2 0 25 The Future Is Now: Advanced Materials The advancement of materials for printed circuit boards, interconnects/interposers, and substrates is of great interest, and for good reason. Moore's Law is no more, and the solutions to grapple with this reality are surprising, stunning, and perhaps—for those looking to plate onto them—a bit daunting. They hold amazing potential for the next chapters of the electronics manufacturing journey. Feature Articles Driving Next-generation PCB Performance by Pesh Patel New Laminate Materials to Meet Today's Challenges by Chris Hunrath Is Glass Finally Coming of Age? by Nolan Johnson Low-loss, Low-CTE Materials Driving the Future by Kirk Thompson Engineering Breakthroughs in High-frequency Circuit Materials by John Coonrod Advanced PCB Material Innovations by Paul Cooke Feature Columns Advancing the Advanced Materials Discussion by Marcy LaRont Feature Interviews Jiva Leading the Charge Toward Sustainable Innovation with Steve Driver 10 22 26 30 40 56 8 44