Issue link: https://iconnect007.uberflip.com/i/1539509
SEPTEMBER 2025 I PCB007 MAGAZINE 13 options enable high-density interconnects without unnecessary board thickness. In EV power modules or 5G base station amplifiers, thermal-bond's 9.0 W/mK conductivity prevents thermal runaway and extends component life. Conclusion Ventec's pro-bond and thermal-bond families repre- sent a leap in PCB bondply technology. By removing glass reinforcement and combining electrical preci- sion with exceptional thermal management, they give OEMs and manufacturers the tools to build faster, cooler, and more reliable electronics without add- ing manufacturing complexity. Whether the priority is ultra-low-loss transmission, robust heat dissipation, or bonding to challenging substrates, these materials deliver where it matters most, enabling the next generation of high-perfor- mance electronics. PCB007 Pesh Patel is VP of sales and technology at Ventec International Group.