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16 PCB007 MAGAZINE I SEPTEMBER 2025 D R I V I N G I N N OVAT I O N A i r g a p N o a i r g a p F i g u re s 1 a n d 2 : Pa n e l o n t h e X- ray t a b l e w i t h va c u u m of f ( l ef t ) a n d va c u u m o n ( r i g ht ) . ▼ how advanced machine functions, based on Schmoll Maschinen's experience and technology, are spe- cifically engineered to master the challenges pre- sented by panel warpage. Inner Layers: Early-stage Compensation In the initial stages of manufacturing, during the production of thin inner layers, warpage is not yet a significant issue. However, these layers can be highly susceptible to bending due to handling. Pre- cision processes like direct imaging (DI) and post- etch punching must ensure the layer remains per- fectly flat during the operation. Machines can be equipped with powerful vacuum tables that securely hold the panels, preventing bending or shifting during exposure or punching. Furthermore, for extremely thin or delicate layers, automated solutions are crit- ical. By eliminating the need for manual operator handling, automated solutions ensure consistent, damage-free transfer, preventing warpage from being introduced early in the process. X-ray Machines For multilayer PCBs, the X-ray process is the most critical step for registration. It consists of two essential phases: measurement and drilling of reg- istration holes. For the results to be reliable, both phases must occur under identical conditions. In a standard X-ray machine, vacuum is often applied only to the center of the table. If a panel is warped, the areas around the fiducials, which are crucial for ▼ F i g u re 3 : Two - st at i o n m a c h i n e w i t h i n d i v i d u a l st at i o n s/t a b l e s a n d C C D s . F i g u re 4 : B l i n d v i a h o l e (d r i l l e d m e c h a n i c a l l y ) . ▼