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20 PCB007 MAGAZINE I SEPTEMBER 2025 Depth Routing As previously explored in Kurt Palmer's August 2025 column, "Depth Routing Processes," this application has its unique set of warpage-related challenges, particularly when creating cavities or separating rigid-flex circuits. To address these, our machines use a second measuring system, depth routing with electrical contact for a perfect start point, and multi-point touch probe mapping to dynamically adjust the depth for every point on F i g u re 1 1 : A t a n d e m t a b l e o n a n M D I m a c h i n e ( r i g ht s i d e t a b l e p a n e l i s c l a m p e d ) . ▼ the panel. The advanced capabilities provided by machine manufacturers are crucial for ensuring that the final routed depth is accurate, regardless of any panel imperfections. Summary The effects of warpage are a constant reality in PCB production. They can arise during various manu- facturing steps and have a serious impact on final board quality. For process engineers, taking these effects into account is not optional; it's mandatory. PCB007 Simon Khesin is the key account manager at Schmoll Maschinen GmbH. To read past columns, click here. F i g u re 1 2 : C ro s s - s e ct i o n of l a s e r v i a h o l e s a b l ate d (d r i l l e d ) w i t h t h e s a m e p a ra m ete rs o n t h e s a m e m a c h i n e, s a m e m ate r i a l s , b u t o n d i f fe re nt P C B s , w h i c h h ave d i f fe re nt d i st a n c e s b et we e n t h e to p l aye r a n d s u b s e q u e nt l aye r. ▼ D R I V I N G I N N OVAT I O N