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SEPTEMBER 2025 I PCB007 MAGAZINE 29 they're a source of abundant expertise. This is why I think that China, Taiwan, and Southeast Asia have a head start in glass." Conclusion Substrate glass has been just over the R&D horizon for years. In 1994, a patent for the use of monolithic glass substrates was filed 2 , which predates the documented R&D work from 2013 that Happy men- tions. But his observations and perspective on glass as a potential substrate are spot on. And in my inde- pendent research, his list of potential suppliers for glass as a substrate was corroborated. As all aspects of electronics manufacturing continue to push into smaller sizes, planarity and coefficients of thermal expansion become much greater challenges. Could glass be the future of PCBs and interconnect devices? Will glass be a Ta b l e 3 : C u r re nt s u p p l i e r s of g l a s s to t h e U.S . m a r ket Supplier U.S. Presence / Role Notes Corning U.S.-based production and R&D, CHIPS Act recipient Key supplier of semiconductor glass Absolics (SKC) Georgia-based production facility funded under CHIPS U.S. manufacturing of glass substrates NEG America U.S. subsidiary of Nippon Electric Glass Supplies specialty glass substrates AGC Inc. Export to and integration with U.S. packaging facilities Major global glass substrate supplier SCHOTT AG Supplies to U.S. advanced packaging ecosystem Global innovator in thin glass packaging sound basis for new packaging solutions? That remains to be seen, but there is ample evidence that glass may soon enter the mainstream in elec- tronics manufacturing. PCB007 Resources 1. "Glass substrate for a semiconductor device and method of making same," by Fukuda, et al. 2. "Glass Interposers for 2.5D and 3D System Integration," by Rao R. Tummala, et al, IEEE IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT), 2011. 3. "Intel Unveils Industry-First Glass Substrates for Advanced Packaging," Intel. 4. "Corning® Glass Substrates for Semiconductor Packaging," Corning Inc. 5. "Glass Substrate for Semiconductor Packaging 2020," Yole Group.