Issue link: https://iconnect007.uberflip.com/i/1539509
32 PCB007 MAGAZINE I SEPTEMBER 2025 • Low-loss dielectric performance: Enabling high-speed signal transmission with minimal attenuation across increasingly dense inter- connect structures • Low CTE formulations: Improving dimen- sional stability across temperature cycles, reducing stress on vias and interfaces—criti- cal for automotive and aerospace reliability • High glass transition temperature (Tg): Allowing sustained performance in thermally demanding environments, such as power electronics and RF front-end modules • Best in class flow and processability: Enabling designs that require sequential lamination, high aspect ratio and fine lines These properties are vital for maintaining electrical and mechanical integrity as PCB designs evolve to support higher layer counts, finer features, and increasingly integrated packaging schemes. High Reliability and Harsh Environments: IS580G, TerraGreen 400G, I-Tera MT40, and Tachyon 100G The full suite of Isola advanced materials reaches across footprints, environments, and applications to meet challenging design and engineering criteria. • Astra MT77 is tuned for RF/MW applications like automotive radar, but has the flexibility of being applicable for some SERDES applications. MT77 is also being used for automotive radar systems like ADAS (Advanced Drive Assistance System) and AD (autonomous driving). • Tachyon 100G is a product meant for the HSD (high speed data) space, but is also adaptable to a spectrum of RF applications. • I-Tera MT40, Tachyon 100G and TerraGreen 400G are used extensively in server and telecommunication infrastructure. • And IS580G is being used extensively for automotive "in-cabin sensing" applications. • For LEO (Low Earth Orbital Satellites) applica- tions, there are of course both, digital and RF parts, so the full array of advanced materials are used. Manufacturing Agility and Processability Additionally, these new laminate and prepreg sys- tems are optimized for high-yield PCB fabrication, incorporating key processing areas. • Drill performance and copper adhesion: Enabling precise via formation and strong interconnect reliability. • Resin flow and lamination stability: Sup- porting consistent dielectric thickness and minimal defects in HDI and RF/microwave designs. • Compatibility with modern metallization and surface finishes: Enhancing manufac- turability for next-gen packaging such as system-in-package (SiP) and embedded component architectures. Strategic Value Makes for a Winning Combination As businesses grapple with the demands of new F i g u re 1 : ( Lef t ) I m a g e of a t ra n s m i s s i o n /re c e i v i n g m o d u l e ; ( R i g ht ) I m a g e of a c o nt ro l b o a rd . ▼