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56 DESIGN007 MAGAZINE I OCTOBER 2025 E lectronics deployed in harsh conditions face relentless threats from vibration, impact, chemi- cal contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsu- lating electronics in a protective polymer, is a widely used strategy to safeguard devices from both envi- ronmental and mechanical hazards. As devices become increasingly smaller, smarter, and more connected, safeguarding them has become more complex. This article examines the challenges of protecting modern electronics, with a particular focus on wireless sensor applications where reliable RF signal transmission and mois- ture resistance are critical. It compares key perfor- mance characteristics of epoxy-, polyurethane-, and silicone-based potting materials, discusses material A RT I C L E by B et h M a s s ey, M a c D e r m i d A l p h a E l e ct ro n i c s S o l u t i o n s Sealed for Survival: Potting Electronics for the Toughest Environments selection criteria, and highlights the need for inno- vative formulations. Real-world case studies, such as tire pressure monitoring systems (TPMS) and water monitoring sensors, demonstrate how these materials directly influence device performance and long-term reliability. Why Potting Matters Moisture and contaminants in the operating envi- ronment pose a serious threat to the performance and longevity of electronic devices. Even small amounts of water vapor or condensation can lead to short circuits, corrosion, component degradation, and permanent damage. Environmental pollutants, such as sulfur compounds, acids, and fine particu- lates, when combined with moisture, rapidly accel- erate corrosion and damage. Devices operating