Issue link: https://iconnect007.uberflip.com/i/1540184
OCTOBER 2025 I DESIGN007 MAGAZINE 69 • Edge AI devices for fab-line inspection at UHDI resolution • Integration of inspection with ERP/MES for real-time factory visibility • Autonomous inspection systems driven by generative AI for CAD-to-inspection logic • Blockchain-enabled defect tracking and com- ponent genealogy • Autonomous manufacturing lines with inte- grated fab-line automated inspection Conclusion UHDI manufacturing demands inspection systems that are more than accurate; they must be intelligent, adaptive, and seamlessly integrated. Advanced automated inspection technologies not only reduce defects and costs but also form the foundation of traceable, reliable, and scalable UHDI production across all manufacturing sectors. DESIGN007 Anaya Vardya is president and CEO of American Standard Circuits; co-author of The Printed Circuit Designer's Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals. He is the author of Thermal Management: A Fabricator's Perspective, The Printed Circuit Designer's Guide to DFM Essentials, and The Companion Guide to Flex and Rigid-Flex Fundamentals. Visit I-007eBooks.com to download these and other free, educational titles. Revenue for the global interposer market is project- ed to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20% over the forecast period. Interposers, which are substrates that enable high-density connections between chips, have be- come a critical component in the semiconductor in- dustry's drive for faster, smaller, and more power- efficient devices. According to the report, 2D inter- posers, which currently dominate the market, ac- count for over half of the global share. However, 2.5D and 3D designs are expected to gain momentum as packaging technologies advance. The report notes that this demand is fueled by the proliferation of wearable electronics, smartphones, and other connected devices, which account for al- most half of the consumer electronics sales world- wide. Additionally, innovations in semiconductor packaging, particularly water-level packaging tech- niques, are making interposers more accessible for manufacturers. According to analysts, the rapid advance in minia- turization trends will see interposers remain a crit- ical component in the global semiconductor supply chain through the next decade. However, despite these advances, the market is still grappling with high costs, including volatile pric- ing of raw materials, complex design requirements, and testing issues, particularly when it comes to sili- con-based interposers. North America currently leads the market with about 39% share, thanks to strong R&D investment and advanced semiconductor manufacturing. The Asia-Pacific region has 33 percent of the market share, fueled by demand in China, Japan, and South Korea. Among the major players are Murata, Tez- zaron, Xilinx, TSMC, AGC Electronics, and Amkor. (Source: I-Connect007 Editorial Team) Global Interposer Market to Surge Nearly Fivefold by 2034