Issue link: https://iconnect007.uberflip.com/i/1540184
4 DESIGN007 MAGAZINE I OCTOBER 2025 O CTO B E R 2 0 25 Power Integrity Current power demands are increasing, especially with AI, 5G, and EV chips. As technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share "watt's up" with power integrity, from planning and layout through measurement and manufacturing. Features The Shaughnessy Report: Watt About Power Integrity? by Andy Shaughnessy Everyone's Talking About Power by Heidi Barnes Beyond Design: The Fundamental Structure of Spectral Integrity by Barry Olney AI Triggers Next Paradigm Shift in PDN by Istvan Novak Elementary, Mr. Watson: High Power: When Physics Becomes Real by John Watson PDN Optimization: Balancing Performance and Cost in Modern SoC Designs by Zach Caprai Target Condition: Distribution of Power: Denounce the Ounce by Kelly Dack Designers Notebook: Power and Ground Distribution Basics by Vern Solberg Columns Connect the Dots: Designing for the Reality of UHDI PCBs: Drilling by Matt Stevenson Articles Sealed for Survival: Potting Electronics for the Toughest Environments by Beth Massey UHDI Technology and Automated Inspection by Anaya Vardya 6 8 14 20 24 30 40 50 46 56 66 S h o r t s AT&S Plans Entry Into the Defense Sector The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics Global Interposer Market to Surge Nearly Fivefold by 2034 I n E ve r y I s s u e MilAero007 Design007 Top 10 Career Opportunities Educational Resources Advertiser Index 49 64 69 38 70 73 78 79