IPC International Community magazine an association member publication
Issue link: https://iconnect007.uberflip.com/i/1543955
4 I-CONNECT007 MAGAZINE I MARCH 2026 56 122 128 129 In Every Issue MilAero007 Highlights Career Opportunities Educational Resources Advertiser Index MARCH 2026 March Madness Inspired by the spirit of March Madness, this issue takes on a full bracket of challenges that affect the work of PCB designers and fabricators. From the growing role of AI in design tools to the chal- lenge of managing cumulative tolerances, these articles examine the technical details, design choices, and manufacturing consider- ations that determine whether a board works as intended. I-Connect007 Features Feature Articles 18 Make the Smart Move by Stephen V. Chavez 22 Understanding Tolerances in Flexible Circuit Design by Chris Clark Feature Columns Target Condition: 78 An Exploration of Flooding PCB Layers by Kelly Dack Interviews 12 When Layout Learns: This Is Not Your Mother's Auto-router with Ben Jordan 30 ASTER and Siemens: Design for Test Gets 'Real' with Michael Alum and Patrick Hope Articles 104 DesignCon 2026: From Copper to Quantum to Agentic AI by Kelly Dack Columns Flexible Thinking: 62 Designing Flex Circuits for Dynamic Reliability by Joe Fjelstadt Connect the Dots: 68 Designing for the Future of Manufacturing Reality— Solder Mask and Legend by Matt Stevenson Designers Notebook: 92 Heterogeneous Interposer Design Challenge, Part 3 by Vern Solberg Beyond Design: 100 ReRAM—The Industry's Next Game-Changer by Barry Olney Marcy's Musings: 8 Our Own March Madness by Marcy LaRont 86 Don't Call It Ground; Call it Return by Kristin Moyer