IPC International Community magazine an association member publication
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82 I-CONNECT007 MAGAZINE I MARCH 2026 ARTICLE In the second of this two-part series, I examine applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications Driving the Convergence Consumer Electronics Smartphones, wearables, and foldable devices are prime examples of flex and advanced packaging working in tandem. System-in-package (SiP) mod- ules integrate multiple dies, while flex PCBs inter- connect them across compact and often curved internal geometries. Flex enables antenna integration, camera and sensor placement flexibility, and ultra-thin device architectures. Automotive and Mobility Systems ADAS, EV power electronics, and autonomous platforms require high-performance compute Applications, Challenges, and the Future of FLEX–PACKAGING INTEGRATION BY A N AYA VA R DYA , A M E R I CA N STA N DA R D C I RC U I TS PART 2 VIEW PART 1 HERE