I-Connect007 Magazine

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• I-Connect007 Magazine — March 2026: March Madness!
• Design007 Content
• PCB007 Content
• Marcy's Musings: Our Own March Madness
• Feature Interview: When Layout Learns: This Is Not Your Mother's Auto-router
• Feature Article: Make the Smart Move
• A Faster Path to Funded Workforce Training in California
• Feature Article: Understanding Tolerances in Flexible Circuit Design
• Feature Interview: ASTER and Siemens: Design for Test Gets 'Real'
• The Chemical Connection: Managing Cumulative Process Variations for Fun and Profit
• Beyond the Board: How Advanced PCB Design is Reshaping Mil/Aero Electronics
• Interview: From Classroom to Boardroom, A World of Perspective
• Happy's Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups
• Article: New, Greener Solutions for Etch, Novel Copper Extraction
• Mil/Aero007 Highlights
• American Made Advocacy: American Microelectronics Power the Future of High Technology
• Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
• Connect the Dots: Designing for the Future of Manufacturing Reality—Solder Mask and Legend
• Article: Webinar Review: The Challenges of UL Certification for Flex and Flex-Rigid PCBs
• Target Condition: An Exploration of Flooding PCB Layers
• Article: Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
• Feature Article: Don't Call It Ground; Call It Return
• Designer's Notebook: Heterogeneous Interposer Design Challenge, Part 3
• Beyond Design: ReRAM, The Industry's Next Game-Changer
• Article: DesignCon2026, From Copper to Quantum to Agentic AI
• The Right Approach: Reflections on 50 Years in the Business, Part 3
• Interview: The Electronics Foundation
• Interview: The Power of Apprenticeship
• I-007e Educational Resources
• Masthead and Advertiser Index
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