92 I-CONNECT007 MAGAZINE I MARCH 2026
D ES I G N E R 'S N OT E B O O K
I
n just about any industry, time-to-market will
establish the difference between the leaders
and followers. Any new electronic product
introduced into the market must meet or exceed
stated performance criteria and provide reliable
service to the end user experience.
The original single-core monolithic system-on-
chip developed for the earlier, less complex
applications has long been superseded by the
more sophisticated multiple-core variations.
Furthermore, developers have separated the less
complex functional elements of the system from
the core functions, into individual chiplet units, re-
sulting in improved overall product yields. Chiplet
packaging has become an integral part of a pro-
cessing module that makes up a larger, system-
level integrated circuit.
A chiplet is an integrated circuit block specifically
designed to work with other related chiplets to
meet the system-level package criteria. The chiplet
BY V E R N S O L B E RG, C O N S U LTA N T
Heterogeneous
Interposer Design
Challenge, Part 3
Editor's note: Part 3 of the Heterogeneous
Interposer Design Challenge series highlights
alternative chiplet terminal design, pattern
variations, and advanced ultra-high-density
hybrid joining methodologies.
Figure 1: Chiplet-configured
system-in-package. (Source: AMD)
Read Parts 1 and 2
