MARCH 2026 I I-CONNECT007 MAGAZINE 49
Fortunately, there are many excellent resources
to help educate designers on these issues.
1, 2
Summary
A data-driven strategy for the creation of a multi-
layer stackup is essential for performance and reli-
ability in HPC and AI server designs. Signal integ-
rity and power integrity challenges, combined with
finer component pitches and higher connection
counts, create a unique set of demands for today's
PCB designer.
The most successful programs treat stackup de-
sign as a complete workflow: modeling and simula-
tion, material selection, validation with fabricators,
and manufacturing processes that improve predict-
ability. Automation, especially pinless layup and
optical alignment with welding, can significantly
improve registration and consistency in complex
sequential-lamination multilayers. I-CONNECT007
H A P PY'S T EC H TA L K # 47
Happy Holden has worked in
printed circuit technology
since 1970 with Hewlett-Pack-
ard, NanYa Westwood, Merix,
Foxconn, and Gentex. To read
past columns, click here.
Did you know?
Happy Holden is currently working with
Clyde Coombs on their next edition of
Printed Circuits Handbook. Happy is also
a contributing editor... Automation and
Advanced Procedures in PCB Fabrication,
and 24 Essential Skills for Engineers.
References
1. More Secrets of High-Speed PCBs by Martyn
Gaudion, Stackups: The Design within the
Design by Bill Hargin, The HDI Handbook by
Happy Holden, and many more.
2. Stackups: The Design within the Design by Bill
Hargin, pg. 67, 2022.
3. "PCB Tech Match: How to Choose the Right PCB
Technology for Your Application," by Gerry Partida,
Oct. 3, 2024.
4. "Next Progression in Microvia Reliability Valida-
tion—Reflow Simulation of a PCB Design Attri-
butes and Material Structural Properties During
the PCB Design Process," by Gerry Partida, IPC
APEX EXPO, 2022.
