AUGUST 2026 I I-CONNECT007 MAGAZINE 119
Figure 10: Routing of a very-fine pitch BGA using HDI, and VeCS-2 buried slots with close-up of quarter-pattern.
(Source: NextGin Technology)
References
1. "Finstrate: A New Concept in IC Substrates,"
Steve Leishman, IPC Seminar on Competitive
Electronics Packaging, October 1983, Washington, D.C.
2. "Vertical Conductive Structures—a New Dimen-
sion in High-Density Printed Circuit Interconnect," Pete
Starkey, The PCB Magazine, February 2017, pp. 16-20.
3. "Vertical Conductive Structures, Part 1: Rethinking
Sequential Lamination," Joan Tourné, PCB007 Maga-
zine, April 2019, pp. 88-93.
4. "Vertical Conductive Structures, Part 2: VeCS and
Micro-machining," Joan Tourné, PCB007 Magazine, June
2019, pp. 72-78.
5. "Vertical Conductive Structures, Part 3: Design Tool
Techniques," Joan Tourné, PCB007 Magazine, August
2019, pp. 90–99.
6. "Vertical Conductive Structures, Part 4: Tuning Your
Signal Performance," Joan Tourné, PCB007 Magazine,
October 2019, pp. 68–76.
H A P PY'S T EC H TA L K
7. Vertical Conductive Structures, Joan Tourné, EIPC
Winter Conference 2020 presentation.
8. "The Impact and Benefits of VeCS Technology," an
interview with Joan Tourné and Joe Dickson, PCB007
Magazine, November 2020, pp. 30-43.
9. VeCS-New High-Density Interconnects, Joe Dickson,
Linkedin, November 2020. I-CONNECT007
Happy Holden has worked
in printed circuit tech-
nology since 1970 with
Hewlett-Packard, NanYa
Westwood, Merix,
Foxconn, and Gentex. He
is currently a contributing
technical editor with
I-Connect007, and the author of
Automation and Advanced Procedures in PCB
Fabrication, and 24 Essential Skills for Engineers.
To read past columns, click here.
