IPC International Community magazine an association member publication
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120 I-CONNECT007 MAGAZINE I AUGUST 2026 A RT I C L E BY R I C H A R D N I C H O LS A N D M A R KO M I R KOV I C, G R E E N S O U RC E E N G I N E E R I N G Evaluating Physical Process Parameters to Improve Copper Plating Distribution Consistent copper thickness across panels directly affects etching accuracy, conductor geometry, electrical perfor- mance, and ultimately, product reliability. It is a persistent manufacturing chal- lenge, and for PCB fabricators serving advanced markets—including RF applica- tions, power electronics, and other high- performance technologies—electrolytic copper plating is one of the most critical process steps. In response, manufacturers typically modify shielding, rectification, or tooling, which may require an expensive hard- ware change. Chemistry and current density have also traditionally received much of the industry's attention in plating optimization. But what if much of that optimization could begin before any hardware, chemistry, or current density changes were made? GreenSource Engi- neering explored this question by taking a controlled look at how much influence the physical dynamics of the plating process itself have on copper distribution. To that end, the Engineering team examined the influence of three physical process variables: horizontal agitation, vertical agitation, and pump pressure, using its RESOLUTION™ V vertical plating platform. The results suggest that process dynamics alone can have a measurable impact on plating uniformity. Figure 1: A simplified schematic of an electroplating module with four plating cells, the sump, and copper replenishment system.