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AUGUST 2026 I I-CONNECT007 MAGAZINE 121 Looking Beyond Chemistry GreenSource's vertical plating platform is a modu- lar electroplating system designed for demanding applications requiring thick copper deposits and high aspect ratio blind microvias. Rather than re- lying solely on conventional process optimization techniques, the system incorporates several design features intended to improve electrolyte movement and mass transport throughout the plating cell. Each module consists of four independently controlled plating cells with dedicated electro- lyte circulation. A dense array of closely spaced fluid delivery nozzles directs electrolyte across both sides of the panel, while programmable hori- zontal and vertical mechanical agitation continually refreshes the boundary layer at the copper surface. Together, these features are designed to create a more consistent electrochemical environment across the entire work area. Our goal was not simply to increase plating speed, but to improve plating uniformity while supporting the heavy copper requirements being demanded by advanced power electronics manufacturers. Establishing the Baseline One aspect of the study makes it particularly inter- esting. Rather than first optimizing the hardware through shielding, bussing modifications, or recti- fier adjustments as would normally be done during equipment qualification, the engineering team in- tentionally evaluated the system in a largely unopti- mized configuration. The production rack used during testing provided electrical contact only from the top of the panel. Four-sided contact, commonly employed to improve current distribution, had not yet been implemented. Likewise, shielding and other electroplating refine- ments remained untouched. Figure 2: a) A rendering of the complete electroplating module; b) Crossection of the electroplating cells.