I-Connect007 Magazine

I007-Aug-2026

IPC International Community magazine an association member publication

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AUGUST 2026 I I-CONNECT007 MAGAZINE 123 conducted on production equipment, making the findings particularly relevant to real manufacturing environments. What the Results Revealed Although each of the nine test conditions produced its own distribution profile, the overall trends be- came clear once the data were evaluated collec- tively. Most importantly, the plating system con- sistently achieved copper distribution within ±15% across the panel, with many conditions approach- ing ±10% variation. One experimental run emerged as an obvious outlier because of its lower overall plating thickness rather than an inherent distribution problem. Once that condition was separated from the broader anal- ysis, the remaining results demonstrated remark- ably consistent plating performance. Perhaps more importantly, the data showed that the physical process variables did not contribute equally. • Increasing horizontal agitation consistently improved copper distribution • Increasing vertical agitation also produced measurable improvements in plating uniformity • Conversely, increasing pump pressure be- yond the lower settings proved detrimental to distribution These findings reinforce an important principle in electroplating: More electrolyte flow is not necessarily better. Uniform mass transport depends not simply on fluid velocity but on how effectively fresh electrolyte is exchanged across the plated surface without creating localized disturbances. Mechanical agitation appears to promote that balance more effectively than simply increasing pump pressure alone. Engineering Implications The significance of these findings extends beyond this particular plating platform. Electroplating optimization often begins with hardware modifications: adjusting shields, refining bussing arrangements, or altering current distribu- tion. While those techniques remain valuable, they can also increase installation time, engineering effort, and qualification costs. This study suggests that careful optimization of physical process dynamics may provide mean- ingful improvements before those additional mechanical adjustments become necessary. Figure 4: A distribution map of the Orientation Test, which led to interest in testing the potential influences of the physical parameters on the results.

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