I-Connect007 Magazine

6 I-CONNECT007 MAGAZINE I AUGUST 2026 APRIL 2026 Features 56 The Relevance of VeCS as an HDI Process Option by Marcy LaRont Happy's Tech Talk 106 Vertical Conductive Structures (VeCS) by Happy Holden Articles 68 Preparing for a New Laminate Supply Reality by Mark Goodwin 102 Micro-robot Exoskeletons With Rigid-flex PCBs by Anaya Vardya 122 Evaluating Physical Process Parameters to Improve Copper Plating Distribution by Richard Nichols and Marko Mirkovic Columns Powering the Future 40 From Substrate to System: The Power Module Assembly by Brian Buyea American Made Advocacy 84 American PCBs in Big Demand and Short Supply by Shane Whiteside Trouble in Your Tank 96 Pre-electroless Causes of Voids by Michael Carano The Chemical Connection 126 More Solutions to Common PCB Etching Questions by Don Ball In Every Issue MilAero007 Highlights Career Opportunities Educational Resources Advertiser Index 88 130 138 139 25 Shorts Below the Surface Why Thermal Failure Is Still the No. 1 Killer in Power Electronics by Chandra Gupta AUGUST 2026 74 VeCS HDI Process Technology: Has the Time Come for Broader Adoption? by Joan Tourné

• I-Connect007 Magazine — August 2026: From Ecosystems to Innovation
• Design007 Contents
• PCB007 Contents
• Marcy's Musings: The Power of the Electronics Ecosystem
• Target Condition: Life in the Engineering Ecosystem
• Elementary, Mr. Watson: PCB Design Is a Team Sport (Revisited)
• Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics
• Feature Interview: Designing for a More 'Intelligent' and Connected Future
• Flexible Thinking: Beyond DFM PCB Design and Manufacturing as a Cooperative Effort
• Feature Article: Who Really Designs The PCB?
• Powering The Future: From Substrate to System The Power Module Assembly
• Special Section: A Closer Look at AI Data Centers
• Special Section: Powering AI Inside TeraWulf's Lake Mariner Campus
• Special Section Infographic: Anatomy of an AI Data Server
• Special Section: The AI Data Center Boom Technology, Capacity, and Society
• Feature Article: The Relevance of VeCS as an HDI Process Option
• Designer's Notebook: Implementing Strategic Planning Principles for PCB Design
• Article: Preparing for a New Laminate Supply Reality
• Feature Article: VeCS HDI Process Technology Has the Time Come for Broader Adoption?
• American Made Advocacy: American PCBs in Big Demand and Short Supply
• Mil/Aero007 Highlights
• Connect the Dots: What PCB Designers Should Know About Materials
• Trouble In Your Tank: Pre-electroless Causes of Voids
• FLEX007 Article: Micro-robot Exoskeletons With Rigid-flex PCBs
• Happy's Tech Talk: Vertical Conductive Structures (VeCS)
• Article: Evaluating Physical Process Parameters to Improve Copper Plating Distribution
• The Chemical Connection: More Solutions to Common PCB Etching Questions
• I-Connect007 Educational Resources
• I-Connect007 Masthead and Advertiser Index
• Problems Solved! Subscribe to our magazines.