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108 I-CONNECT007 MAGAZINE I AUGUST 2026 fabrication equipment. This allows HDI densities to be achieved without significant added costs along with easier fabrication processes and higher elec- trical performance and reliability. The process and applications already developed by NextGin Tech- nology are: VeCS -1, -2, and -HDI 2,3 . The three main combinations of their interconnect slot technology are defined as: • VeCS-1: Where the channel (slot) goes through the substrate • VeCS-2: Here, the slot is formed as blind or in a hybrid-blind and through-slot combination • VeCS-HDI: Laser-drilled microvias are used for fine-pitch utility on ultra-fine-pitch components Figure 2 highlights these three structures. With channels (slots) formed from both sides, the 3D vertical traces provide greatly increased density without sequential laminations. Replacing larger through-hole vias with slots provides better power integrity for new power-hungry chips while lowering inductance and capacitance for improved signal integrity. The Channel or Slot The all-important step of metallizing and plating the typical 0.3 mm blind slot is shown in Figure 3. for vari- ous depths and lengths (from depths of 0.47 mm to 1.23 mm and lengths of 0.6 mm to 1.8 mm). Some of the smaller aspect ratios have insufficient chemical exchange but the majority have excellent chemical Figure 2: (Left) Three different structures, based on the original concept of a slot or trench, make up VeCS; (right) trace routes showing various layers, and 3D views of the construction. (Source: NextGin) H A P PY'S T EC H TA L K