60 I-CONNECT007 MAGAZINE I AUGUST 2026
engineering, where those systems can be uti-
lized and moved into the PCB. That's where
some of the transformational value engineering
will come. You'll enable it."
It was also noted that the PCB designer
should be obligated to explore all possible
ways a product can be built, with reliability,
manufacturability, and cost in mind. Once de-
signers become more open-minded about
using alternative processes, doors will open to
broader adoption of these now-proven meth-
ods for constructing reliable vertical connec-
tions in dense PCBs.
We are, indeed, seeing a great need for more
innovative solutions to come to the fore, and
I believe we are just scratching the surface of
what will come over the next two decades.
I challenge PCB designers and fabricators to
read the articles in this issue with an open mind.
We know that change comes slowly to our in-
dustry, but we no longer have the luxury of al-
lowing this slow pace. To my knowledge, large
Asian fabricators like Wus are resisting proto-
type and small run production. As yet, adop-
tion of VeCS industry-wide is still relatively low.
Considering our business diversification topic
in the July issue and the realities of today's
global PCB market (and tomorrow's), there may
well be a lucrative opportunity here for those
willing to take a hard look. I-CONNECT007
References
1. "Vertical Conductive Structures—a New
Dimension in High-Density Printed Circuit
Interconnect," by Pete Starkey, The PCB
Magazine, February 2017.
2. "Vertical Conductive Structures, Part 1:
Rethinking Sequential Lamination," by Joan
Tourné, PCB007 Magazine, April 2019.
3. "Vertical Conductive Structures, Part 2: VeCS
and Micro-machining," by Joan Tourné,
PCB007 Magazine, June 2019.
4. "Rethinking Interconnects With VeCS Tech-
nology," by Nolan Johnson, PCB007 Maga-
zine, July 2020.
Figure 8: Clean cross routs using alternative bits and
parameters.
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Figure 7: Alternative bit from HPTec.
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