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www.atotech.com As advanced packaging architectures continue to push the limits of miniaturization, electroless copper deposition has be- come essential for sub-5 µm line-and-space designs. Meanwhile, manufacturers are facing increasing variability in dielectric materials, feature geometries, and thickness requirements. The question is no longer just how to achieve ultra-thin copper, but also how to do so with sufficient flexibility to support a broad range of process conditions. Trends and manufacturing context Next-generation package substrates demand tighter geome - tries, improved reliability, and compatibility with low-rough- ness dielectric materials. Electroless copper plays a central role in enabling SAP-based manufacturing, especially when uniform seed layers, strong adhesion, and reliable microvia coverage are necessary. However, while a single chemistry may meet the challenges of today, it is unlikely to meet the needs of tomorrow. For substrate manufacturers this means that as their technical demands change, they will need to investigate and test new chemical processes, and once a new candidate is identified, follow this with extensive customer qualification. The solution – A flexible electroless copper platform MKS' Atotech addresses this challenge with the Printoganth ® MV TP3 series, an adaptable electroless copper platform designed for advanced packaging applications. Rather than being a single process, the series offers a flexible approach that supports a wide range of Cu thickness requirements, and by utilizing a common base formulation the process chemistry can be readily simplified to extend capability while minimizing the need for extended testing and re-qualification. · Printoganth ® MV TP3: Ultra-low thicknesses below 150 nm · Printoganth ® MV TP3 Mod: 150–250 nm · Printoganth ® MV TP3 Mod2: Above 250 nm This flexibility means that manufacturers can retain the familiarity and experience gained when operating at higher deposit thickness as they progress to the finer line and spaces that are supported by the variants within the Printoganth MV TP3 platform. Performance and process benefits Across all variants, the Printoganth MV TP3 series is built on a common performance foundation: · Best-in-class bath initiation with zero dummy plating required, reducing waste and improving efficiency · Fine epitaxial crystal growth, enabled by bottom-up recrystallization, supports reliable interconnect formation · Excellent adhesion to low-roughness dielectrics, which is critical for next-generation substrates · Outstanding throwing power for uniform coverage of high-aspect-ratio blind microvias (BMVs) This combination enables manufacturers to achieve ultra-thin, uniform copper deposits while maintaining process stability and scalability for high-volume production. Manufacturing impact The Printoganth MV TP3 series simplifies process integration and reduces the need for multiple, disconnected chemistries by covering a wide range of copper thicknesses within a single product family. The series enables a more consistent and controllable metallization strategy, from ultra-thin seed layers to thicker functional deposits. When used with compatible activation systems, such as Neoganth ® or Cupraganth ® MV, the series supports uniform deposition across challenging material sets and advanced build-up films. This helps manufacturers meet technical and economic targets. In short As advanced packaging continues to evolve, flexibility in elec- troless copper deposition is becoming a key differentiator. The Printoganth MV TP3 series provides a scalable, high-perfor- mance solution, enabling manufacturers to adapt copper thick- ness to their specific requirements while maintaining reliability, adhesion, and coverage. For greater flexibility in electroless copper deposition, the Printoganth MV TP3 series offers a practical path forward for next-generation advanced packaging manufacturing. Roger Massey Global Product Manager PTH/STT at MKS' Atotech roger.massey@mks.com +44 7881 26 56 92 Electroless copper for advanced packaging – From ultra-thin deposition to process flexibility