Issue link: https://iconnect007.uberflip.com/i/1456062
14 SMT007 MAGAZINE I MARCH 2022 3 An Analysis of the North American Semiconductor and Advanced Packaging Ecosystem SEMICONDUCTOR MANUFACTURING ECOSYSTEM Semiconductor manufacturing has three principal segments: semiconductor fabrication, IC-substrate fabrication, and OSAT assembly. • Silicon Fabrication: Chip manufacturers produce thin pieces of silicon upon which thousands, millions or even billions of transistors are etched. These silicon chips are responsible for the computing power and/or memory commonly associated with integrated circuits and, by extension, all technologies that rely on electronics. • Integrated Circuit Substrates: IC substrate manufacturers produce base layers used in the packaging of integrated circuit chips. The substrate connects chips with each other and with the printed circuit board (PCB), in addition to protecting, reinforcing, and supporting the IC chip. • Outsourced semiconductor assembly and test (OSAT): OSAT companies offer IC-packaging and test services for chip manufacturers. Their role comes into play at the end stage of the semiconductor manufacturing process following wafer and IC-substrate fabrication. These companies offer packaging and/or assembly solutions that turn bare semiconductors into finished semiconductor packages. These solutions help to protect the tiny circuit on each chip as well as facilitate electrical connections and heat dissipation. After packaging, final testing is conducted to ensure that finished semiconductor packages meet quality, reliability, and performance requirements.