Issue link: https://iconnect007.uberflip.com/i/1460418
44 PCB007 MAGAZINE I MARCH 2022 4. Affix the array and added boards in a fixture that will hold the individual pieces. 5. Apply the glue that will hold the board in the array. 6. Cure the glue either by heat or UV light. 7. Measure the placement to match any specifications (Figure 2). Optimized Repanelization Customers are not always aware of the added costs subpanel-arrays may create. Tightly packed arrays are not a cost problem, but if the customer or EMS has spaced the boards apart and the materials are expensive, this wasted material will increase the cost of the board or array. With the costs of high-layer count mul- Figure 2: Repanelization process and quality control items for the process.