Issue link: https://iconnect007.uberflip.com/i/1493016
REAL TIME WITH... IPC APEX EXPO 2023 SHOW & TELL MAGAZINE I I-CONNECT007 65 REAL TIME WITH... IPC APEX EXPO 2023 SHOW & TELL MAGAZINE I I-CONNECT007 65 a wide range of people just to cover all the aspects of whatever topic that committee is working on. Then you need people with mul- tiple capabilities. You might need someone to perform experiments, another to provide the samples, one to provide field data, and maybe someone to do the analysis of the data that you're working to provide, or even the abil- ity to just write the docu- ment. All those items are needed. I've spent many, many years on the B10A Com- mittee that currently maintains J-STD-020, which is the moisture sen- sitivity classification stan- dard, and that committee owned its predecessor, the IPC-SM-786. Back in the day, we had a very good core team, which now is called an A-Team. We worked very well together, and we had a great mix of users and suppliers—people with dif- ferent backgrounds. Jack McCullen from Intel was one of the original chairs, and he was very active in IPC. Today, Steve Martell from Nord- son is the chair, but Steve works at a company that deals with equipment used for moisture testing. I come from an OEM background, and Jack has a supplier background, so you need those perspectives when you're working on a committee. It seems to me if it were, say, only suppliers or only users, the standard wouldn't be very strong and people would be less likely to use it because they would say, "Hey, that's not for us." Then there's the companion word, consensus, which is the next step in the col- laboration. What do you find exciting about our industry right now? There's quite a bit. One is the big push into automation for inspection because it gives you that initial feedback right away. There's work in the CFX committee to access your real-time manufacturing data and data ana- lytics; you get that immediate feedback and can improve your process right away, mini- mizing rework later. Another of the newer technologies is low-tem- perature solders, which are being developed and implemented for the new heterogeneous packages coming out these days, to ensure that they can be soldered to PWBs with- out causing damage to the device. Then there's the growth in automated handling of data and data exchange standards to allow people to have the data they need and make decisions quickly. It's just interesting to be a part of all that these days. I remember when automated optical inspec- tion for inner layers first came out and people poo-poohed that, saying you were trying to inspect in quality, but the whole point was always the feedback loop you could have. Of course, there wasn't a way to automati- cally feed back the data then, so getting that automated is huge. A part of this award is a scholarship for a university or school of your choice. Have you made a selection? I have chosen my alma mater, the University of Wisconsin-Madison, from which I have a bachelor's and master's in Engineering Mechanics. While an undergraduate, my idea was to work for NASA, so I took classes such as orbital mechanics and aerodynamics. I was part of a senior design project where Dieter Bergman IPC Fellowship Award