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Page 97 of 105

IPC COMMUNITY 98 SUMMER 2023 North America By Brian Knier Vice President, Marketing, Member Success, and Sales IPC and TEEMA Sign MoU to Support Digital Transformation On May 16, IPC's HQ office in Bannockburn, Illinois, hosted a delegation from the Taiwan Electrical and Electronic Manufacturers' Asso- ciation (TEEMA) for an office tour and half-day series of meetings as a precursor to a Memo- randum of Understanding (MoU) signing the next day. On May 17, at EWPTE in Milwaukee, Wisconsin, leadership from TEEMA and IPC were on hand to sign an MoU. The MoU aims to promote the adoption and use of IPC-2591, Connected Factory Exchange, the plug-and- play industry standard for factory communi- cation which sets the baseline for companies to achieve Industry 4.0. IPC and ITI Convene to Examine Critical Environmental Requirements On June 6, IPC partnered with the Infor- mation Technology Industry Council (ITI) to offer an educational conference for the electronics sector on critical environmental requirements. In total, the event played host to 70 attendees, nine speakers, and four spon- sors from 22 U.S. states and 13 countries, who learned about sustainability and eco-design policies in the U.S. and EU; PFAS regulations; REGIONAL UPDATES IPC Around the World

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