Issue link: https://iconnect007.uberflip.com/i/1517130
6 DESIGN007 MAGAZINE I MARCH 2024 COLUMNS The Myriad Opportunities— and Challenges by Andy Shaughnessy Designing for Reality: Prioritizing Manufacturability by Matt Stevenson INTERVIEW PCBflow Helps Designers Choose Best Manufacturer for the Job with Susan Kayesar, Evgeny Makhline, and Peter Tranitz ARTICLES Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1 by Yash Sutariya ASC Sponsors Ultra High Density Interconnect Symposium by Anaya Vardya Designing Electronics for High Thermal Loads by Akber Roy DEPARTMENTS Career Opportunities Educational Resources Advertiser Index & Masthead SHORTS All Flex Solutions Expands Rigid Flex Quick-turn Offering DRAM Industry Sees Nearly 30% Revenue Growth in 4Q23 Design Guidelines for Flexible Printed Circuits Heraeus Printed Electronics, SÜSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing IPC Mourns Loss of Former Vice President of Industry Programs, Tony Hilvers Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage Keysight Technologies Chosen as Test Partner for Deutsche Telecom Satellite NB-IoT Early Adopter Program HIGHLIGHTS MilAero007 Top Ten Editor's Picks 9 14 32 45 54 62 71 22 72 8 28 34 38 50 56 75 84 85 MARCH 2024 • ADDITIONAL CONTENTS 34