Issue link: https://iconnect007.uberflip.com/i/1517130
50 DESIGN007 MAGAZINE I MARCH 2024 Article by Anaya Vardya ASC SUNSTONE Amer ican Standard Circuits ( ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI). As an early adopter of Averatek's A-SAP™ process, ASC is leading the industry in advanc- ing this technology and working with PCB designers and OEM/ODMs on developing new applications that can take advantage of the sub-25-micron line width and space capa- bility. e event is organized by SMTA (Sur- face Mount Technology Association), which has been dedicated to sharing practical knowl- edge in the electronics manufacturing industry for 40 years. Tara Dunn, SMTA director of education and training, and Kat Erdahl, SMTA events and administrative manager, have put together an agenda of the preeminent industry experts in UHDI who will be speaking on various top- ics. In addition to the speakers, there will be a roundtable discussion moderated by Mike Marshall of NCAB Group. John Johnson of American Standard, Alti- um's David Haboud, and Chrys Shea of Shea Engineering will speak on the design of a UHDI PCB test vehicle that ASC will be build- UHDI FUNDAMENTALS: ASC Sponsors Ultra High Density Interconnect Symposium