Design007 Magazine

Design007-Mar2024

Issue link: https://iconnect007.uberflip.com/i/1517130

Contents of this Issue

Navigation

Page 51 of 85

52 DESIGN007 MAGAZINE I MARCH 2024 ing to optimize performance through UHDI design, fabrication, and assembly processes. e PCB test vehicle design will be the topic of the next issue of this UHDI series. Other key discussions will include: 1. UHDI journey: How we got here from the early subtractive processes to the various current technologies that allow the game- changing sub-25-micron trace and space width. 2. Material selection: e choice of materi- als for the interconnects is crucial. Materi- als with high conductivity, low resistance, and good thermal properties are preferred. Copper and gold are commonly used for their excellent electrical conductivity, while materials like silicon and diamond are used for their thermal properties. 3. Design and layout: e design and layout of the interconnects play a significant role in optimizing their performance. Factors such as the width, length, and spacing of the interconnects, as well as the number of layers, need to be carefully considered to minimize resistance, capacitance, and signal delay. 4. Reliability and durability: UHDIs must be reliable and durable to withstand the rig- ors of operation. Techniques such as stress testing, accelerated aging, and failure anal- ysis are used to ensure the reliability and durability of UHDIs. 5. Technology availability: e availability of both domestic and global capability of organizations that can produce this tech- nology is a concern as UHDI applications continue to increase and the ability to meet demand requirements are currently somewhat limited. Title: Ultra High Density Interconnect Symposium >> FULL PROGRAM INCLUDED ON NEXT PAGE >> Date: March 26, 2024 Location: Peoria Sports Complex, Peoria, Arizona Registration Link: Click here. DESIGN007 Anaya Vardya is president and CEO of American Stan- dard Circuits; co-author of The Printed Circuit Designer's Guide to… Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals. He is the author of Thermal Management: A Fabricator's Perspective and The Companion Guide to Flex and Rigid-Flex Funda- mentals.Visit I-007eBooks.com to download these and other free, educational titles.

Articles in this issue

Links on this page

Archives of this issue

view archives of Design007 Magazine - Design007-Mar2024