Issue link: https://iconnect007.uberflip.com/i/1517130
58 DESIGN007 MAGAZINE I MARCH 2024 ing, not during the front-end design process. I firmly believe that today's compact, high-per- formance electronics must be developed with robust thermal management strategies early in the design cycle. is proactive approach not only reduces development time and costs but also helps product designers ensure that crucial electronic components operate in their optimal temperature range, ultimately enabling long-term product safety and reliably. To help designers achieve these goals, I've developed the following overview of best prac- tices and key considerations for managing heat in electronic systems. Understand the Factors Affecting Thermal Load Many factors contribute to the overall ther- mal load in electronic systems, from power consumption and I/O speeds to component package designs, fea- tures, and functions. Drawing on decades of experience supporting PCB fabrication and assem- bly, it becomes apparent that advanced and simple systems alike can grapple with thermal issues, and there is no one-size-fits- all thermal solution. I strongly recommend using thermal mod- eling and simulation tools at the beginning of the design process to aid in understanding the many factors that affect thermal load, identify potential hot spots, and assess the potential effects of different thermal management strat- egies. is approach makes it possible to accu- rately predict thermal behavior in complex electronic systems prior to building physical prototypes. With thermal modeling, designers can efficiently optimize their designs, simulat- ing and analyzing multiple design iterations, while experimenting with different compo- nents and materials. By leveraging thermal modeling, designers can proactively address thermal concerns early in the design process, paving the way for opti- mal performance and longevity. Component Selection and Thermal Resistance (R t ) e components are central to all electronic devices. While all components generate heat, the predominant source of thermal load typi- cally originates from power electronic com- ponents such as MOSFETs and other transis- tors, digital processors like CPUs and GPUs, and RF components including amplifiers and transceivers. When selecting such components, it is important to consult technical datasheets (TDS) for thermal resistance values. ermal resistance (R t ), a measure of a component's resistance to heat flow, is influenced by the material and structure of the component's packaging. Higher R t values signify the potential for a greater internal temperature rise per unit of power dissi- pated, posing increased risks of premature failures. erefore, lower R t values are preferable. While not every com- ponent requires selection based solely on the lowest R t value, understanding these values aids in guiding component selection and provides valuable insights into areas where thermal management solutions may be neces- sary. Material Selection and Coefficient of Thermal Expansion (CTE) Material choices are pivotal to managing heat in electronic systems, especially as they relate to each other in terms of their CTE val- ues, another key value on a component's TDS. Substrates, interposers, components, and sol- der alloy materials with very different CTE values will expand and contract at different rates as they heat up and cool down. is can I strongly recommend using thermal modeling and simulation tools at the beginning of the design process...