Issue link: https://iconnect007.uberflip.com/i/1517130
70 DESIGN007 MAGAZINE I MARCH 2024 layout rules, including component placement, routing, and layer stackup guidelines codified in IPC design standards. ese include: • IPC-2221, Generic Standard on Printed Board Design, which provides guidelines for the design of PCBs, including require- ments for copper thickness, minimum annular ring, conductor spacing, and other design considerations. • IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards, covers specific design considerations for rigid PCBs and includes topics like thermal stress, thermal conductivity, and mechanical considerations. • IPC-2223, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards, reviews the unique design challenges asso- ciated with flexible and rigid-flex PCBs, including bend radius, material selection, and dynamic flexing considerations. • IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, covers qualification and performance requirements for rigid PCBs, including criteria for base materials, conductor thickness, hole plating, and other fabrication processes. • IPC-6013, Qualification and Performance Specification for Flexible Printed Boards, which is like IPC-6012 but is specific to flexible PCBs, covering material proper- ties, design considerations, and fabrication requirements. • IPC-6018, Microwave End Product Board Inspection and Test, focuses on require- ments for microwave PCBs, addressing high-frequency design considerations and inspection/test requirements. • IPC-2226, Sectional Design Standard for High Density Interconnect (HDI) Printed Boards, provides guidelines for the design of HDI PCBs, and involves advanced technologies like microvias, fine-line traces, and high-density component placement. • IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard, gives guidelines for the design of surface mount components, including recom- mended land patterns and component dimensions. Another highly valuable skill is related to actual board manufacturing and assembly. e designer should invest as much time as possi- ble in learning about the actual manufacturing process used in PCB fabrication and assembly, the many materials used in manufacturing, and the circuit features, including line and space, and via dimensions. e decisions made by the designer have far-reaching consequences. Making informed decisions is vital. As signal speeds continue to climb, a designer should have a solid understanding of signal integrity principles, including impedance matching, trace length matching, and noise reduction techniques, along with electromag- netic interference (EMI) regulatory require- ments and standards. is includes paying attention to ESD, which can destroy a board if not well managed. In the realm of the actual product, there is an increasing need to understand and apply thermal management techniques to prevent overheating of components on the PCB. It's a growing problem as the industry moves toward ever-higher performance and physically hotter products. I would be remiss not to mention the ele- phant standing in the corner getting ready to take the stage: PCB design enabled or assisted by artificial intelligence (AI). is will likely be here quicker than most folks can imagine. I'm very intrigued, for example, by Benchmark's recent investment in Quilter, which intends to do just that. However, as Quilter CEO Sergiy Nesterenko said in an interview with Reuters 1 , "Just because (soware) got to 90% comple-