MAY 2024 I DESIGN007 MAGAZINE 71
When assessing PCB
design complex-
ity, first consider the
component area and
board area ratio. If the
surface area for the
component interface is restricted, it may justify
adopting multilayer or multilayer sequential
buildup (SBU) PCB fabrication to enable a
more efficient sub-surface circuit interconnect.
I recently sat down with Nolan Johnson
for the first in a series of discussions
about designing PCBs for the reality
of manufacturing. By sharing lessons
learned over a long career in the PCB
industry, we hope to shorten learning
curves and help designers produce
better boards with less hassle and
rework.
IPC provides the neces-
sary community, stan-
dards framework, and
education to prepare
these pioneers as they
explore the boundaries
of what's possible, equipping engineers with the
knowledge, skills, and resources required to thrive
in an increasingly dynamic field.
Developing
proactive
thermal
management
strategies is
important in the early stages of the
PCB design cycle to minimize costly
redesign iterations. Here, I delve into
key aspects of electronic design that
hold particular relevance for manag-
ing heat in electronic systems.
Donald Telian, a renowned pioneer in SI with over
four decades of experience, is set to share his
expertise with engineers worldwide, beginning in
May 2024. The masterclass will focus on practical
techniques to address SI issues in both current
and future electronic product designs. With a focus
on simplification, his vast experience includes suc-
cessfully doubling data rates more than a dozen
times and solving SI challenges across countless
electronic products and applications.
In my column, I have highlighted key DFM
issues and provided suggested remedies.
But the data packages continue to show no
improvement. Figure 1 presents a high-level
breakdown of PCB data quality key issues. I
always present this chart on the first day of
my IPC course, "PCB Design for Manufac-
turing." I have performed studies over the
years on the quality of incoming data pack-
ages. The bottom-line consistent result is
that less than 5% of these packages can be
fabricated as-is.
For the latest news and information, visit PCBDesign007.com
IPC's Vision for Empowering
PCB Design Engineers
Designing for Reality:
Prioritizing Manufacturability
Designer's Notebook:
What Designers Need to Know
About Manufacturing, Part 2
Dana on Data:
eCAD PCB Design Deficiencies
Designing Electronics for
High Thermal Loads
Signal Integrity Expert Donald Telian
to Teach 'Signal Integrity, In Practice'
Masterclass Globally
