Design007 Magazine

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• Design007 Magazine — May 2024
• Feature Contents — Breaking High-speed Material Contriants
• Additional Contents
• Column — Unlock Your High-speed Material Constraints
• Short — Low-loss Materials: The Enabler of Future Connected Vehicles?
• Feature Interview — Don't Overconstrain Your High-speed PCB Designs
• Short — America Projected to Triple Semiconductor Manufacturing Capacity by 2032, the Largest Growth Rate in the World
• Feature Interview — Traditional Materials, High-frequency Boards?
• Short — Gartner Survey: 61% of Organizations Evolving D&A Model Due to AI
• Feature Interview — Underconstraining Your Materials? Leave It to the Experts
• MilAero007 Highlights
• Feature Column — Dielectric Material Selection Guide
• Feature Interview — Overconstrain? Inderconstrain? Selecting Materials for High-speed Designs
• Column — One for the Archives
• Short — Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process
• Feature Column — Overconstraining: Short, Slim, and Smooth
• Column — Designing for Reality: The Physical Manufacturing Phases
• Short — U.S. Companies Invest Heavily in Robots
• Article — UHDI Fundamentals: UHDI Applications for Wearable Electronics
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead