Issue link: https://iconnect007.uberflip.com/i/1520956
76 PCB007 MAGAZINE I MAY 2024 Figure 2: Some of the technology characteristics of bendable ultra-thin, rigid one-side/two-sided, and multilayer PCBs with very low-profile copper foil: a) Ultrathin glass fabrics like type 1027, and resin systems that are more flexible; b) The technology type for FR-4 semi-flex of one to 10 layers. constraints of bend-to-install. e bend angle is less than 90° or between 90° and 180° while employing a flexible solder mask. e area to be bent is only one layer and is usually thinned and subject to only a maximum of only three bend cycles during its life. Materials Over the years, several materials have been developed that are suitable for the bend-to- install rigid application. Foremost is the newer thin-spread glass prepregs used with the older DiCy-epoxy or cyanate-ester resins (RCC).