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78 PCB007 MAGAZINE I MAY 2024 Figure 4: a–c) Design guidelines from Unimicron-Germany 2 ; d–e) WUS. of the rigid board is usually thinned, either by stackup or by mechanically thinning that por- tion of the board. Depending on the flex thick- ness and bend radius, more than one bend can be achieved, but caution is the key here, as this is not a true flex. More design examples are shown in Figure 5.