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Lab-to-Fab 3D X-ray Inspection System : iX7059 one Our Highest Resolution Inspection System for Inline Applications www.viscom.com Resolution down to 1 µm for extremely accurate measurements Specifically tailored for semiconductor, power module and advanced assembly applications Ultra precise X-ray inspection in real 2D, 2.5D and 3D From RnD to inline inspection ("Lab-to-Fab") With an impressive resolution of 1 micron and consistently competitive cycle times, the iX7059 one is the ideal inspection system for your advanced assembly, power module and semiconductor production line. 3D SPI 3D AOI 3D AXI 3D MXI 3D Bond CCI vAI

• IPC Community — Summer 2024
• Featured Content
• Contents — Stories and Conversations
• Contents — Additional
• Community Connections — What Is the Best Part of My Job?
• Industry Intelligence — From Chips to Systems
• IPC Member Profile — PACE Worldwide: Trining the Next Generation
• IPC Member Profile — Bechtel Plant Machinery Inc. (BPMI)
• WHMA — Wired for Success
• Spotlight: Workforce — World-class in Canada
• Focus on France — The French Connection
• Focus on France — Taking Training to New Heights
• Focus on France — A French Design Community
• Focus on France — An Update From Lauriane
• Focus on France — Fast Facts
• Standards — An Interview With My Mentor
• Show & Tell Magazine Photo Collages
• New Eyes on Sustainability
• Standards — In-mold Electronics
• Standards Update
• Education — Enhance Your Electronics Expertise
• Workforce — Apprenticeships and Funding
• Education — Opportunity Knocks (DETEX)
• A Leader in Sustainability
• Events — Bold Break-throughs
• IPC Asia — Delegation 2024
• Events — Expanding Horizons (South Africa)
• Education — A Plan to Address Workforce Challenges
• Events — Harness the Future (EWPTE)
• Member Milestones
• Q2 Regional Updates — IPC Around the World
• Events — 2024 Programs Q3
• Member Benefits, Advertiser Index and Masthead