Lab-to-Fab 3D X-ray
Inspection System :
iX7059 one
Our Highest Resolution Inspection
System for Inline Applications
www.viscom.com
Resolution down to 1 µm for extremely accurate measurements
Specifically tailored for semiconductor, power module and advanced
assembly applications
Ultra precise X-ray inspection in real 2D, 2.5D and 3D
From RnD to inline inspection ("Lab-to-Fab")
With an impressive resolution of 1 micron and consistently competitive
cycle times, the iX7059 one is the ideal inspection system for your
advanced assembly, power module and semiconductor production line.
3D SPI
3D AOI 3D AXI
3D MXI 3D Bond CCI
vAI
