PCB007 Magazine

IPC invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for IPC APEX EXPO 2025. CALL FOR PARTICIPATION TECHNICAL TOPICS / / ADVANCED PACKAGING/COMPONENTS / ASSEMBLY & TEST PROCESSES / DESIGN / ELECTRONIC ASSEMBLY MATERIALS / EMERGING TECHNOLOGIES / FACTORY OF THE FUTURE / HDI, μHDI AND SUBSTRATES / PCB FABRICATION AND MATERIALS / POWER ELECTRONICS / QUALITY & RELIABILITY / SUSTAINABILITY FOR ELECTRONICS Technical Conference Abstracts and Professional Development Course Abstracts Due September 6, 2024. Conference Poster Abstracts Due October 4, 2024. IPCAPEXEXPO.ORG \ #IPCAPEXEXPO

• PCB007 Magazine — July 2024
• Featured Content — Don't Just Survive, Thrive
• Additional Content
• Column — The Art, Science, and Reality of Thriving
• Short — Global Citizenship: Bringing Two Cultures Together in PCB Manufacturing
• Feature Column — To Thrive, Surround Yourself with Good People
• Feature Q&A — Are You Ready to Thrive? Keep an Open Mind
• Column — Processes to Support IC Substrates and Advanced Packaging, Part 5
• Feature Interview — Thriving in the Global PCB Market
• Feature Column — I've Found My 'Why'
• Feature Article — Technology Adoption and the Role of Automation
• Feature Interview — Thriving With New Processes and Technologies
• Article — A Less Expensive PCB Fab Startup
• Article — A Visit to RoBAT
• Feature Interview — From Concept to Reality: Building Alpha Circuit
• Column — Domestic Manufacturing Takes Center Stage on Capitol Hill
• Short — Miniaturizing a Laser on a Photonic Chip
• Column — Controlling an Alkaline Etch Bath With Low Copper Loading
• Short — Book Excerpt: The Printed Circuit Designer's Guide to…Designing for Reality
• MilAero007 Highlights
• Feature Interview — Thriving Through Partnership: Alpha Circuit's Journey With IPS
• Column — Novel Ultra HDI Architectures
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead
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