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www.atotech.com The search for improved signal transmission capabilities while maintaining structural integrity is a constant challenge in the ever-evolving field of printed circuit board manufacturing. To tackle this issue, MKS' Atotech has developed NovaBond ® PX-S2 which is poised to revolutionize this dynamic landscape. The new process is a unique bonding enhancement technology that reshapes traditional high-speed signal transmission and ultra- low roughness adhesion promotion. The NovaBond PX-S2 chemistry seamlessly combines nano- rough - ening through selective etching with the benefits of chemical adhesion promoters. In contrast to conventional methods, this innovative approach preserves trace geometry and line width with unparalleled precision. The result is a signal integrity (SI) performance on par with untreated conductors, together with exceptional thermal reliability and bond strength – all essential attributes for applications that demand unwavering performance under various operating conditions. Precision is key Precision is the cornerstone of advanced manufacturing. The NovaBond PX-S2 process achieves this with remarkable accuracy. Its hybrid bonding technique strikes a delicate balance that enables precise control of nano-roughening while maintaining line thickness. Innovative processes carefully create nano- cavities that allow for superior bonding at the molecular level without compromising line-width reduction. The unique capability enables manufacturers to easily meet the demanding requirements of today's applications by producing detailed components with unmatched precision and reliability. Outstanding bonding performance Central to the NovaBond PX-S2 solution is its highly oriented adhesion promoter – a true game-changer in improving bonding performance. The promoter ensures superior adhesion prop - erties critical to a wide range of applications and facilitates optimal absorption of organosilane coatings. Its reliability in the most demanding environments is underscored by its re- sistance to even the most rigorous reliability tests. Through a synergistic blend of mechanical interlock and interfacial chem- ical bonding, it forms strong bonds that can withstand various stresses and conditions, thereby ensuring the long evity and reliability of the bonded structures. High signal integrity – minimal loss In the world of high-speed communications, signal integrity is crucial – and the NovaBond PX-S2 process meets the challenge. Its ultra-low roughness results in significantly reduced signal absorption, a critical attribute for applications where minimal signal loss is essential. Maintaining signal integrity with minimal loss enables seamless and efficient communication between systems and devices, enhancing performance in critical signal reliability scenarios. Overall, the NovaBond PX-S2 process is a breakthrough techno- lo gical innovation. It redefines the landscape of high-speed signal transmission and adhesion promotion in PCB manufacturing. Advanced performance, precision design, and unmatched signal integrity make this technology the foundation for innovation and reliability in electronics. As the industry marches forward into the future, NovaBond PX-S2 is ready to lead the way into a new era of bonding enhancement technology that reshapes traditional high-speed signal transmission and ultra-low rough - ness adhesion promotion. Thomas Thomas Global Product Manager Surface Treatment Technology Atotech Taiwan Ltd. +886 965 816 781 Thomas.thomas@atotech.com Revolutionizing high-speed signal transmission by promoting ultra-low roughness adhesion Adhesion Promoter Copper Dielectrics