Issue link: https://iconnect007.uberflip.com/i/1524164
90 PCB007 MAGAZINE I JULY 2024 As an example, my TechTalk #1 2 provides an example of a 4+4+4 (Figure 7b) HDI build- up replaced by the VeCS example in Figure 7c with only one lamination and no laser-drilled microvias or in Figure 7d with the use of micro- vias over the VeCS core. VeCS is used for interconnections by creat- ing a routing channel (slot) in the printed cir- cuit that then can be metallized and plated eas- ier than high-aspect ratio vias and will allow connection to inner layers. e channels can be created by existing PCB fabrication equipment. is allows HDI densities without significant added costs yet easier fabrication processes and higher electrical performance and reliabil- ity. e process and applications already devel- oped by NextGIn Technologies are: VeCS-1, -2, and -HDI. e three main combinations of their interconnect slot technology: • VeCS-1: Where the channel (slot) goes through the substrate • VeCS-2: Where the slot is formed as blind or in a hybrid-blind and through-slot combination • VeCS-HDI: Laser-drilled microvias are used for fine-pitch utility on ultra- fine-pitch components Figure 7: a) VeCS are a true 3D architecture brought about through the use of drill/router slots that allow metallization and plating, and then the slot vertical connectivity is isolated by secondary drilling; b) HDI example of 4+4+4 replaced with (c) by drilled slots or (d) microvias plus VeCS core; e) Connections are made to the plated slot-edge view and top view 2 .