Issue link: https://iconnect007.uberflip.com/i/1527952
24 PCB007 MAGAZINE I OCTOBER 2024 Feature Q&A with Rich DePoto UYEMURA As customer requirements bump up against manufacturing standards and upper-limit plat- ing capabilities in today's rapidly evolving man- ufacturing landscape, understanding alterna- tives to traditional best practices is critical for continued success. In this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immer- sion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final fin- ishes. He delves into the intricacies of electro- less nickel corrosion and "black pad," explor- ing its causes, consequences, and the measures Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies that can be taken to mitigate this problem. is comprehensive overview will provide insight toward sound decision-making for those oper- ating in environments where perfect process control is a challenge. Please explain DIG and RAIG plating technologies and how they compare with more traditional final finish technologies. Rich DePoto: Reduction-assisted Immersion Gold (RAIG) is a platform of final finish pro- cesses that are the next generation of immer- sion gold electrolytes. RAIG electrolytes were developed to address three important limita-