Issue link: https://iconnect007.uberflip.com/i/1527952
4 PCB007 MAGAZINE I OCTOBER 2024 OCTOBER 2024 • FEATURED CONTENT Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been intro- duced over the past few years as miniaturization and advanced packaging continue to develop. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods. Alternate Metallization Processes FEATURE INTERVIEWS The Cost-Benefit Analysis of Direct Metallization with Carmichael Gugliotti Exploring Advanced PCB Final Finishes: DIG and RAIG with Richard DePoto Unlocking Advanced Circuitry Through Liquid Metal Ink with John Johnson Exploring Innovation Through Alternative Metals and Sputtering with Dr. Evelyne Parmentier FEATURE COLUMNS Destination Metallization by Marcy LaRont Processes to Support IC Substrates and Advanced Packaging, Part 5 by Mike Carano 10 24 60 78 8 44 10 78 24 60