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22 DESIGN007 MAGAZINE I MARCH 2025 Feature Article by Gerry Partida Summit Interconnect In the dynamic world of PCB manufacturing, achieving first-pass success hinges on more than just cutting-edge equipment and skilled teams. At Summit Interconnect, we have seen countless successful launches of advanced HDI designs that can be traced directly to engage- ment between designers and fabricators early in the design phase. Unfortunately, collaboration in the PCB industry oen begins only aer problems arise—such as field failures, assembly fallout, or low fabrication yields. is reactive approach is the wrong starting point for collaboration. When issues surface late in the design cycle or during production, the costs of fixing them escalate exponentially. Redesigns, delays, The Key to First-pass Success in PCB Design