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28 DESIGN007 MAGAZINE I MARCH 2025 Over the past two decades, I've simulated numerous complex, high-speed designs for customers creating computer-based products. In addition, I've conducted signal integrity soware training courses and led classes on high-speed design. In this month's column, I will reflect on the key considerations for achieving a successful high-speed PCB design that performs reliably, and I'll highlight some of the common signal integrity issues that I fre- quently encounter. Beyond Design by Barry Olney, IN-CIRCUIT DESIGN PTY LTD / AUSTRALIA Key SI Considerations for High-speed PCB Design Arguably, the most critical factor in high- speed PCB design is the impedance of the interconnect. We know that transmission line drivers must be matched to the impedance of the line for the perfect transfer of energy. Energy is never lost but rather transforms into other forms of energy. Specifically, for an unmatched transmission line, energy can be transferred into heat, coupled into adjacent elements, reflected, or radiated—all of which should be avoided.